Chapter 50

Material properties

Several materials are commonly used in integrated circuits. These materials are mainly silicon, and silicon dioxide. Other materials of interest are mold compound, and FR4 epoxy as they are in the immediate environment of ICs.

50.1 Electrical data

50.1.1 Silicon

Silicon is the most widely used material inside ICs. All components but true capacitors are built from silicon.

50.1.1.1 Dielectric constant

ϵ R=12.9

50.1.1.2 Carriers Mobility

In semiconductors, two types of carriers exist.

50.1.1.3 Resistivity

50.1.1.4 Breakdown electrical field

50.1.2 Silicon dioxide

Silicon oxide is probably the most used material after silicon in ICs. Capacitors are built from metal and oxide and the dielectric layers between connection layers are made from oxide.

50.1.2.1 Dielectric constant

ϵ R=3.9

50.1.2.2 Breakdown electrical field

EB=10^9V/m

50.1.3 Silicon nitride

Silicon nitride is used as a passivation layer over the metal stack and final oxide.

50.1.3.1 Dielectric constant

ϵ R=7.5

50.1.3.2 Breakdown electrical field

EB=V/m

50.1.4 Mold compound

Mold compound is the material surrounding silicon in molded plastic packaged ICs.

50.1.4.1 Dielectric constant

ϵ R=

50.1.4.2 Breakdown electrical field

EB=V/m

50.1.5 FR4 epoxy

PCBs, often made from FR4 material are the ICs environment outside the package.

50.1.5.1 Dielectric constant

ϵ R=4.35

50.1.5.2 Breakdown electrical field

EB=V/m

50.2 Thermal data

50.2.1 Silicon

50.2.1.1 Thermal conductivity

149 W/(m.K)

50.2.1.2 Thermal coefficient of expansion

50.2.1.3 Specific heat

50.2.2 Silicon dioxide

50.2.2.1 Thermal conductivity

1.4 W/(m.K)

50.2.2.2 Thermal coefficient of expansion

50.2.2.3 Specific heat

50.2.3 Silicon nitride

50.2.3.1 Thermal conductivity

50.2.3.2 Thermal coefficient of expansion

50.2.3.3 Specific heat

50.2.4 Mold compound

50.2.4.1 Thermal conductivity

50.2.4.2 Thermal coefficient of expansion

50.2.4.3 Specific heat

50.2.5 FR4 epoxy

50.2.5.1 Thermal conductivity

50.2.5.2 Thermal coefficient of expansion

50.2.5.3 Specific heat

50.3 Mechanical data

50.3.1 Silicon

50.3.1.1 Density

50.3.1.2 Young's modulus

50.3.1.3 Tensile strength

50.3.2 Silicon dioxide

50.3.2.1 Density

50.3.2.2 Young's modulus

50.3.2.3 Tensile strength

50.3.3 Silicon nitride

50.3.3.1 Density

50.3.3.2 Young's modulus

50.3.3.3 Tensile strength

50.3.4 Mold compound

50.3.4.1 Density

50.3.4.2 Young's modulus

50.3.4.3 Tensile strength

50.3.5 FR4 epoxy

50.3.5.1 Density

50.3.5.2 Young's modulus

50.3.5.3 Tensile strength

compteur.js.php?url=%2FCuq%2BrY5pFc%3D&d